Qualcomm is expected to announce its flagship Snapdragon 8 Gen 2 chipset at its annual summit that’s taking place between November 15-17 and we expect all the major Android OEMs to bring devices with it soon after. A new series of leaked specs from tipster Digital Chat Station suggest we’ll see the upcoming flagship chipset on the Honor Magic5.
The device will also reportedly feature a curved high refresh rate 6.8-inch display with PWM dimming. In terms of cameras, Magic5 will bring a 50MP main shooter with AI ISP tuning. The flagship will also offer an IP-68 rating for water and dust resistance and blazing-fast 100W wired and 50W wireless charging.
In related spec leaks news, DCS also reports of a new foldable phone from Honor that’s also expected to use the Snapdragon 8 Gen 2 chipset and 66W wired charging.
Nah, IMX800/IMX866 is going to be new IMX766, I assure. IMX766 was the new IMX586. If you consider the value and importance of their specifications for their eras, you will get what I mean. IMX989 is top-notch, it has ultra-large size and its process...
It definitely won't, only in your wildest dreams. They won't even use it for ultra premium foldables.
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