It was exciting to see support for UCIe technology at this year’s Design Automation Conference. UCIe Consortium members Alphawave Semi, Blue Cheetah Analog Design, Inc., proteanTecs, Siemens EDA (Siemens Digital Industries Software), Synopsys Inc, and more showcased UCIe technology demos to highlight the benefits of an open chiplet ecosystem. View our photos for highlights from #61DAC.
About us
- Website
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http://UCIexpress.org
External link for Universal Chiplet Interconnect Express (UCIe)
- Industry
- Computer Networking Products
- Company size
- 11-50 employees
- Type
- Nonprofit
Employees at Universal Chiplet Interconnect Express (UCIe)
Updates
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At FMS 2023, UCIe Consortium Member Manuel Mota from Synopsys Inc explored usage models for UCIe technology including server or AI scaling, heterogenous computing, IO or memory split, resource aggregation with retimers, and more. Watch the presentation to see how multi-die systems have been adopted across market segments: https://bit.ly/4acASP2 #UCIeConsortium #UCIe #chiplets #server #AI #IO #memory #retimer
Explore the usage models for UCIe technology - FMS 2023
https://www.youtube.com/
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The “UCIe 1.1 Specification: Backward Compatible Evolution of UCIe for Driving an Open Chiplet Ecosystem with New Usage Models” white paper outlines the UCIe 1.1 specification’s enhancements to automotive, streaming protocol usages, cost optimization solutions, and compliance enhancements. Download the white paper to learn more about the evolution of UCIe technology: https://bit.ly/3sOgqmN #UCIeConsortium #UCIe #chiplets
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Our webinar recordings are all available on the UCIe Consortium’s website. Learn directly from industry experts and explore how UCIe is driving the adoption of chiplet technology with topics ranging from AI Hardware trends, UCIe in Automotive, packaging technologies, and more. Watch our webinars: https://bit.ly/3kOD1Lh #UCIeConsortium #UCIe #chiplets
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At FMS 2023, UCIe Consortium Manageability / Security Work Group Co-Chair Jerome Glisse from Google provided an overview of UCIe’s security efforts and software composability at every level. Watch the presentation to learn more: https://bit.ly/3tete5N #UCIeConsortium #UCIe #chiplets #security
UCIe Manageability and Software - FMS 2023
https://www.youtube.com/
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Become a UCIe Consortium member to help influence the direction of UCIe technology by participating in our workgroups, accessing draft specifications, and voting to shape the future of the standard. Learn more about our membership benefits today: https://bit.ly/3KkdS3Y #UCIeConsortium #UCIe #chiplets #SoC
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The UCIe 1.1 Specification delivers valuable improvements in the chiplet ecosystem, extending reliability mechanisms to more protocols and supporting broader usage models. The specification also included enhancements for the automotive industry including predictive failure analysis and health monitoring and enabling lower-cost packaging implementations. The specification also details architectural specification attributes to define system setups and registers used in test plans and compliance testing to ensure device interoperability. Request the UCIe 1.1 specification to learn more: bit.ly/3sL4cem #UCIeConsortium #UCIe #chiplets
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UCIe Consortium member Synopsys Inc is showcasing a die-to-die connectivity demo featuring their UCIe PHY IP this week at the Design Automation Conference (DAC). The demo shows two implementations: 64 lanes for advanced packaging technology and 16 lanes for standard packaging technology. Learn more about the demo by visiting their booth no. 2441 and by visiting their website: https://bit.ly/3RpIi9U #UCIe #61DAC
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Tomorrow, June 26, at 1:45 pm, UCIe Consortium MWG Chair Brian Rea will present “The UCIe 1.1 Specification: Our Journey Toward Building an Open Ecosystem of Chiplets” at the Keysight Technologies Theater in Exhibit Hall, Level 1, Booth No. 1501 during the Design Automation Conference. Learn more about the Design Automation Conference and view the full agenda: https://bit.ly/3x41Byt #61DAC #UCIeConsortium #UCIe #chiplets
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This Wednesday, June 26, at 11 am, UCIe Consortium MWG Chair Brian Rea will present “UCIe: Building an Open Ecosystem of Chiplets for On-Package Innovations” at the proteanTecs booth in Exhibit Hall, Level 1, Booth No. 2417 during the Design Automation Conference. Learn more about the Design Automation Conference and view the full agenda: https://bit.ly/3x41Byt #61DAC #UCIeConsortium #UCIe #chiplets
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