SPT Microtechnologies USA, Inc.

SPT is looking to hire a seasoned Sales Executive with a proven track record of sales and account management in the semiconductor capital equipment industry. If interested, email your resume to recruiter@sptmicro.com #SPTMicro #semiconductor #RVPAce #AVPAce #SalesExecutive

#SEMICONWest #SEMICONTaiwan #SPTMicro #RVPAce #AVPAce

Device Feature: Introducing Compound Etching Devices "Sirius" & "Spica" Today, we are introducing "Sirius" & "Spica". These are devices used for plasma etching of compound materials and dielectric materials. Depending on your purpose and application, we will propose either "Sirius" or "Spica". "Spica" is particularly good at low-damage and high-precision etching of compound semiconductors. ●Sirius  <Features of this product>  ・Generates high ion density plasma on the wafer through a distinctive plasma source, achieving a high etching rate for difficult-to-etch materials. ・Good uniformity etching by adjusting the ion density distribution on the wafer. ・Capable of anisotropic etching and high aspect ratio etching. ・Compatible with various wafer sizes (standard: Φ3 inches to Φ8 inches) 　 ※Please inquire for other wafer sizes and work shapes. ・Not only resist masks, but also SiO2 masks and metal masks have been used extensively. <Applicable Applications> ・Silicon photonics/optical waveguides: SiO2 film and SiN film ・Filter device materials: LT/LN (LiTaO3/LiNbO3) and quartz oscillators, etc. ・High-frequency electronic device materials: Back via etching of SiC ・Power device materials: SiC trench ・MEMS field: Microlenses and microchannels ・Others: Organic materials, Poly-Si, etc. ●Spica  <Features of this product> ・Etching device that reduces damage to the wafer, in contrast to Sirius. ・Equipped with an RF power supply that can output accurately even at low RF power, achieving high-precision processing. ・Etching is possible not only with F series but also with Cl series. ・Compatible with various wafer sizes (standard: Φ3 inches to Φ8 inches) 　 ※Please inquire for other wafer sizes and work shapes. <Applicable Applications> ・High-frequency electronic device materials: SiN, GaN, GaAs, InP ・Power device materials: Capable of etching GaN, GaO, etc. quickly and stably. ・MEMS field: Microlenses and microchannels ・Others: Organic materials, magnetic films, etc. If you have any requests for microfabrication or process requirements other than the above materials, please feel free to consult with us. ＝＝＝＝ ■Inquiry Form https://lnkd.in/gC2bay6e

See you tomorrow! Our colleagues from SPP Technologies Co.,Ltd. will also be onsite. #SEMICONWest #SPTMicro #RVPAce #AVPAce

●Remote Support Service Now Available! Our SPT Remote Support Service is a new form of support service that reflects the current social situation (response to COVID-19). We offer: "Peace of mind with connectivity when needed" "Prevention of information leakage through the 'Digital Shielding Function' that hides non-target devices" "Advanced support by skilled technicians" "Reduction of cause identification and travel time" "A sense of security as if someone is next to you through shared vision and voice calls" Specifically, through Microsoft HoloLens 2 (Microsoft Corporation), we connect our support staff with remote customer sites, providing services that allow real-time response to troubles and support for preventive maintenance of devices. We also assist with training such as technical guidance for devices without the need to dispatch instructors. ●Microsoft HoloLens 2 Description https://lnkd.in/gu-3TtuH If you are interested, we look forward to your inquiries at the contact information below. ＝＝＝＝ ■Inquiry Form  https://lnkd.in/gC2bay6e

Joint Development Agreement with National Yang Ming Chiao Tung University in Taiwan Taiwan’s National Yang Ming Chiao Tung University (located in Hsinchu City, Taiwan, referred to as Chiao Tung University) and SPP Technologies Inc. (based in Chiyoda-ku, Tokyo, President: Toshihiro Hayami, referred to as SPP Technologies) have reached an agreement for collaborative development in Taiwan of a large-diameter neutral beam atomic layer etching, deposition, and bonding process. They have recently finalized the contract for this venture. The neutral beam technology is an ultra-cutting-edge microfabrication technique invented by Professor Seiji Samukawa of Chiao Tung University during his tenure at Tohoku University before joining the former. The advancement of this technology into cutting-edge devices has been actively pursued for the past five years within an institution established based on the inter-university agreement between Tohoku University and Chiao Tung University (Yang Ming Chiao Tung University/Tohoku University Joint Research Center). Numerous research findings have already been published. With the professor’s transfer to Chiao Tung University in August 2022, efforts have commenced towards new research aimed at industrializing this technology in Taiwan, taking into account insights from prominent local semiconductor device manufacturers. Our initial goal is to develop a mass production system compatible with 8-inch substrates for compound semiconductors by 2025, followed by targeting the development of a mass production system for cutting-edge silicon technology using 12-inch substrates by 2027. Atomic layer etching, deposition, and bonding technology are anticipated to be indispensable for future ultra-cutting-edge devices beyond 2 nanometers, and we are committed to contributing in this area. The neutral beam technology presents significantly lower substrate damage compared to conventional atomic layer etching, deposition, and bonding techniques. Leveraging this advantage, our aim is to develop devices that align with state-of-the-art semiconductor manufacturing processes. In the course of our development, we are actively promoting collaboration with local equipment manufacturers and semiconductor companies in Taiwan. Our aim is to achieve mass production aligned with Taiwan’s ecosystem promptly. Additionally, we are committed to pioneering the development of cutting-edge mass production equipment through a novel approach of Japan-Taiwan international industry-academic cooperation. [Initial Issuance on September 22, 2023] [Inquiries Regarding This Matter] ■Department: Marketing Department ■Contact Person: Egashira ■Contact Information:  https://lnkd.in/gC2bay6e

Today we're celebrating Product Support Engineer Maureen Kelsen's retirement as she wraps up nearly 40 years with SPT! We asked her a few questions about her time here and colleagues shared what they'll miss:

Wishing our colleagues and customers in Japan Happy Golden Week!