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Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process.
iStockCloseup Of Silicon Die Are Being Extracted From Semiconductor Wafer And Attached To Substrate By Pick And Place Machine Computer Chip Manufacturing At Fab Semiconductor Packaging Process Stock Photo - Download Image Now
Download this Closeup Of Silicon Die Are Being Extracted From Semiconductor Wafer And Attached To Substrate By Pick And Place Machine Computer Chip Manufacturing At Fab Semiconductor Packaging Process photo now. And search more of iStock's library of royalty-free stock images that features Semiconductor photos available for quick and easy download.Product #:gm1468266144$12.00iStockIn stock
Download this Closeup Of Silicon Die Are Being Extracted From Semiconductor Wafer And Attached To Substrate By Pick And Place Machine Computer Chip Manufacturing At Fab Semiconductor Packaging Process photo now. And search more of iStock's library of royalty-free stock images that features Semiconductor photos available for quick and easy download.Product #:gm1468266144$12.00iStockIn stockImages
Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process. stock photo
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Largest size:6400 x 3600 px (21.33 x 12.00 in.) - 300 dpi - RGB
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- Semiconductor Photos,
- Computer Chip Photos,
- Manufacturing Photos,
- Technology Photos,
- Industry Photos,
- Factory Photos,
- Electronics Industry Photos,
- Circuit Board Photos,
- Computer Photos,
- Production Line Photos,
- Electrical Component Photos,
- CPU Photos,
- Computer Wafer Photos,
- Wafer Photos,
- Cleanroom Photos,
- Nanotechnology Photos,
- Machine Part Photos,
- Equipment Photos,
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