Samsung Electronics unveiled its next-generation process blueprint at the Samsung Foundry Forum 2024 (SFF 2024), but the response from the semiconductor industry has been somewhat lukewarm. Some viewpoints believe that compared to TSMC and Intel, Samsung lacks the leading "weapons" and lags behind the development of new technologies such as silicon-photonics and Back-Side Power Supply Network (BSPDN).
The JEDEC Solid State Technology Association has announced that it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard.
Ever since Nvidia CEO Jensen Huang championed the "Sovereign AI" strategy at the 2024 World Government Summit, global governments have been in a rush to establish their own AI infrastructure and invest in semiconductors.
The 2024 World Artificial Intelligence Conference (WAIC) held in early July reflects a deep conviction of participants in the power of change brought by the Large Language Model (LLM). It was a perfect window to monitor the engagement of various companies in this trend.
Recent years have seen shakeups in the traditional dichotomy of the processor landscape, in which Arm ruled the mobile market with its low power consumption and cost, while Intel dominated the x86 space aimed mainly at PCs and servers.
Sanjay Mehrotra, CEO of US memory chip vendor Micron Technology, recently visited Taiwan accompanied by other senior executives from the company. During the tour, Mehrotra and Taiwan's Economic Minister J.W. Kuo met with President Lai Ching-te.
L&T Semiconductor Tech, a subsidiary of Indian conglomerate Larsen & Toubro, plans to focus on semiconductor IC design in its initial phase, followed by the development of a Gallium Nitride (GaN)/ Silicon Carbide (SiC) fabrication facility in the second phase.
Driven by emerging applications such as electric vehicles (EV), AI, and high-performance computing (HPC), IC substrates have attracted significant attention in the semiconductor industry. Although Taiwan, Japan, and South Korea currently account for nearly 90% of IC substrates globally, China and the US are quickly gaining ground.
Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing) and AI (Artificial Intelligence) fields.
